| ¢ÙCleaning |
| 1.Special care shall be taken when applying the chemicals
listed below for cleaning because certain chemicals may damage the
surface of lens or
case and cause discoloration. |
|
Solvent
|
Adaptability
|
| Ethyl alcohol, lsopropyl alcohol |
O
|
Trichloroethylene, Chlorothene
Acetone, Thinner |
X
|
|
| |
| 2.Dipping time: 2 minutes max. at normal
temperature. |
 |
| |
| ¢ÚForming |
| 1.The lead frame should be bent at
a point 2 mm away from the body resin. |
 |
| |
| 2.Bending should be performed with
the base firmly fixed by means of a jig or radio pliers. |
 |
|
| 3.Lead forming should be performed prior to soldering. |
| 4.Avoid applying any stress to resin in order to
prevent the epoxy fracture and break on bonding wire. |
| 5.Avoid Forming the lead Frame at the same point
twice or more. |
| |
| ¢ÛSoldering |
| 1.Be sure not mount LEDs in
conditions where excessive stress is applied to
lead frames. |
 |
| |
| 2.The
mounting direction of the flat package type LED should be such
that the direction of the LED electrodes is perpendicular
to the direction of the board curve. |
 |
| |
| 3.ETR will not guarantee LEDs mounted directly on the board because the
resin bodies may be damaged by the applied force
from board - warping, lead-cutting or clinching when being soldered. (It
is strongly recommended
that this should be carried out after very careful
preparation.) |
| 4.Care should be taken to avoid any shock or vibration
to the LED resin body after
it has been soldered until the temperature of the LED has returned to normal. |
| 5.Conditions |
|
